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? 2015 microchip technology inc. ds00001957c-page 1 utc2000 highlights transition any existing usb type-a design to a usb type-c tm downstream facing port or any existing type-b design to a usb type-c upstream facing port leverage the usb type-c reversible cable and compact form factor for use with usb 2.0, usb 3.0 or usb 3.1 supports legacy, 1.5a, & 3.0a usb type-c charging profiles compact 3 x 3mm 16-pin qfn package commercial, industrial, and automotive extended temperature support requires minimal design effort target applications laptops desktop pcs monitors usb hubs usb wall chargers industrial automotive key benefits usb type-c cable connection and orientation detection orientation detection indicator for optional usb switch control powered cable detection with vconn powered cable supply control cfg_sel pin configurable charging profiles: - 5v legacy dfp mode (500ma for usb 2.0, 900ma for usb 3.0/usb 3.1) - 5v @ 1.5a dfp mode - 5v @ 3.0a dfp mode -ufp mode enable pin for host/hub port control vmon pin monitors vbus overvoltage conditions usb type-c audio adapter detection and control ocs# fault input pin fault_ind fault indicator output pin operating voltage range: - 4.5v to 5.5v package - 16-pin qfn (3 x 3 x 0.9mm) environmental - commercial temperature range (0c to +70c) - industrial temperature range (-40c to +85c) - extended temperature range (-40c to +125c) basic usb type-c tm controller downloaded from: http:///
utc2000 ds00001957c-page 2 ? 2015 microchip technology inc. to our valued customers it is our intention to provide our valued customers with the best documentation possible to ensure successful use of your microchip products. to this end, we will continue to im prove our publications to better suit your needs. our pub- lications will be refined and enhanced as new volumes and updates are introduced. if you have any questions or comments regarding this pub lication, please contact th e marketing communications department via e-mail at docerrors@microchip.com or fax the reader response form in the back of this data sheet to (480) 792-4150. we welcome your feedback. most current data sheet to obtain the most up-to-date version of this data sheet, please register at our worldwide web site at: http://www.microchip.com you can determine the version of a data sheet by examining its literature number found on the bottom outside corner of any page. the last character of the literature number is the version number, (e.g., ds 30000a is version a of docu- ment ds30000). errata an errata sheet, describing minor operational differences from the data sheet and recommended workarounds, may exist for current devices. as device/documentation issues be come known to us, we will publish an errata sheet. the errata will specify the revision of silicon and revision of document to which it applies. to determine if an errata sheet exists for a particular device, please check with one of the following: microchips worldwide web site; http://www.microchip.com your local microchip sales office (see last page) when contacting a sales office, please specify which device, re vision of silicon and data sheet (include literature num- ber) you are using. customer notification system register on our web site at www.microchip.com to receive the most current information on all of our products. downloaded from: http:///
? 2015 microchip technology inc. ds00001957c-page 3 utc2000 table of contents 1.0 introduction ..................................................................................................................................................................................... 4 2.0 pin descriptions .......................................................................................................... .................................................................... 7 3.0 functional description .................................................................................................... .............................................................. 11 4.0 operational charac teristics ............................................................................................... ............................................................ 19 5.0 utc2000 system application ....................................................................................................................................................... 23 6.0 packaging information .................................................................................................................................................................. 33 appendix a: data sheet revision history ........................................................................................................................................... 37 the microchip web site ........................................................................................................ .............................................................. 39 customer change notification service ............................................................................................................................................... 39 customer support ............................................................................................................................................................................... 39 product identification system ................................................................................................. ............................................................ 40 downloaded from: http:///
utc2000 ds00001957c-page 4 ? 2015 microchip technology inc. 1.0 introduction 1.1 general description the usb type-c tm specification was introduced in august 2014 and su bstantially expands the capabilities of usb. the key new features include: new connector - smaller form factor - 24 pins - reversible insertion simplified current capability marking - resistor-divider implementation instead of dp/dm handshake the microchip utc2000 usb type-c controller targets designer s who wish to gain the benefits of the small, reversible form factor and elevated charging current abilities of a u sb type-c solution while minimally impacting the overall cost per port. the utc2000 usb type-c controller is a cost-effective, simple solution that facilitates rapid migration of legacy usb 2.0/3.0 designs to the usb ty pe-c connector. the utc2000 controller is designed for usb 2.0/3.0 downstream facing port (dfp) and upstream facing port (ufp) applications and performs all of the necessary detection and control required for implementing a basic usb type-c connector. the utc2000 features adcs that monitor the cc1 and cc2 pins of the usb type-c receptacle to detect various connection events. in a dfp application, passive cables, powered cables, a nd usb audio adapters can all be detected. controls for enabling a usb +5v port power switch, vconn 5v active cable supply, and audio adapter enable are all included. addi- tional features include host enable control and overcurrent detection. in a ufp application, the utc2000 detects a valid usb type- c connection, the plug orientation, and the charging capa- bility of the dfp. the utc2000 also monitors vbus to ensure a valid vbus range and detected overcurrent. the utc2000 can operate from a single 4.5v-5.5v supply and is available in commercial, industrial and extended tem- perature range options. 1.2 usb type-c tm downstream facing port (dfp) implementation overview a utc2000 implementation of a dfp minimally requires 5 major components/circuitry blocks: microchip utc2000 a usb 2.0 downstream port (usb 3.0/usb 3.1 may optionally be implemented based upon system requirements) a usb type-c receptacle a 5v port power controller capable of supplying the advertised current capability (advertised with the value of rp and the pull-up voltage) cc pin circuitry: - rp pull-up resistors - vconn control/switching a system diagram utilizing the utc2000 in a dfp ap plication is shown in figure 1-1 . note: a high-speed or super speed usb switch is also recommended but optional. for usb 2.0 applications, this component may be omitted. for usb 3.0/usb 3.1 applications, this component may only be omitted if two usb 3.0/usb 3.1 downst ream ports are dedicated for use on the usb type-c port. downloaded from: http:///
? 2015 microchip technology inc. ds00001957c-page 5 utc2000 figure 1-1: typical dfp application block diagram 1.3 type-c upstream facing port (ufp) implementation overview a utc2000 implementation of a ufp minimally requires 4 major components/circuitry blocks: microchip utc2000 a usb 2.0 upstream port (usb 3.0/usb 3.1 may optio nally be implemented based upon system requirements) a usb type-c receptacle cc pin circuitry: - rd pull-up resistors a system diagram utilizing the utc2000 in a ufp ap plication is shown in figure 1-2 . note: a high-speed or super speed usb switch is also recommended but optional. for usb 2.0 applications, this component may be omitted. for usb 3.0/usb 3. 1 applications, this component may not be omitted unless a microchip hub with flexconnect is utilized. refer to the microchip usb5734 usb type-c evalu- ation board for details on implementation. microchip utc2000 (dfp mode) 5v port power controller vbus usb mux/ switch plug_orientation# usb host usb ppc_en usb usb cc1 cc2 enable vconn2_out# vconn1_out# 5v vconn rp rp ocs# downloaded from: http:///
utc2000 ds00001957c-page 6 ? 2015 microchip technology inc. figure 1-2: typical ufp application block diagram 1.4 glossary of terms 1.5 references usb type-c tm cable and connector specification: http://www.usb.o rg/developers/docs/ table 1-1: glossary of terms term definition adc analog to digital converter afe analog front end cc generic reference to usb type-c tm cable / connector cc1/cc2 pins dfp downstream facing port ( usb type-c cable and connector specification definition) drp dual role port ( usb type-c cable and connector specification definition) microchip microchip technology incorporated por power-on reset usb type-c usb type-c cable / connector ufp upstream facing port ( usb type-c cable and connector specification definition) note: usb type-c tm and usb-c tm are trademarks of usb implementers forum. optional protection from ov,oc microchip utc2000 (ufp mode) usb mux/ switch usb device usb usb cc1 cc2 rd rd usb connected# vbus system power legacy_ind# 1.5a_ind# 3.0a_ind# vmon plug_orientation# ocs# current sense adc input resistors limit leakage when unpowered downloaded from: http:///
? 2015 microchip technology inc. ds00001957c-page 7 utc2000 2.0 pin descriptions the utc2000 pin diagram can be seen in figure 2-1 . ta b l e 2 - 1 provides a pin assignment table. pin descriptions are provided in section 2.2 pin descriptions . 2.1 pin assignments figure 2-1: pin assignments table 2-1: pin assignments pin number pin name 1 ocs# 2 cfg_sel 3 enable 4 fault_ind 5 audio_adapter/connected# 6 cc2 7 cc1 8 vconn2_out#/legacy_ind# 9 vconn1_out#/1.5a_ind# 10 ppc_en/3.0a_ind# 11 plug_orientation# 12 vmon 13 vss 14 nc 15 nc 16 vdd note 1: the exposed pad should be connected to vss . utc200 0 vmon plug_orientation# ppc_en / 3.0a_ind# vconn1_out# / 1.5a_ind# 9 10 11 12 5 6 audio_adapter / connected# cc2 vconn2_out# / legacy_ind# cc1 7 8 2 3 1 14 15 16 13 4 nc nc v dd ocs# cfg_sel enable fault_ind v ss downloaded from: http:///
utc2000 ds00001957c-page 8 ? 2015 microchip technology inc. 2.2 pin descriptions table 2-2: pin descriptions name symbol buffer type description digital inputs controller enable enable is active high enable signal. the utc2000 will remain in its default, inactive state unless this pin is asserted high. if unused, tie this pin to vdd through a 10k ? pull-up resistor. fault input ocs# is (pu) this active low signal is asserted by the +5v vbus power sup- plying device to notify the utc200 0 when a system fault condi- tion has occurred. typically, this signal is used for overcurrent or overvoltage conditions, but it can be used for any system related failure. all digital control outputs will revert to their default, deasserted state when this pin is asserted. normal operation will resume after deassertion of this pin. after any ocs# assertion, a fault flag will be set and the fault_ind pin will assert. this flag is only cleared after a device reset or power cycle. if unused, this pin can be left floating. analog inputs configuration selection cfg_sel adc this analog to digital converter pin is sampled at power-on at vcfg_samp to place the utc2000 in either dfp or ufp mode. once in ufp mode, the utc2000 will always remain in ufp mode and can only switch to dfp mode after a power-on reset. once in dfp mode, the utc2000 can actively switch between 3.0a, 1.5a, or the default legacy (500ma usb 2.0, 900ma usb 3.0/usb 3.1) dfp modes without power cycling. when switch- ing between dfp modes, the voltage thresholds and ranges for connection detection on the cc1/cc2 pins are modified accordingly. refer to table 3-1 for additional details. vbus voltage monitor vmon adc this analog to digital converter pin monitors the input voltage on the vbus pin of the usb receptacle. the utc2000 will enter the fault state and deassert all outputs if the voltage exceeds 0.8v on the vmon pin (>6.4v on vbus). a fault flag will be set and the fault_ind will assert after any overvoltage occurrence. this flag is only cleared after a device reset or power cycle. this pin is required for ufp modes. if unused in dfp modes, tie this pin to gnd through a 10k ? pull-down resistor. downloaded from: http:///
? 2015 microchip technology inc. ds00001957c-page 9 utc2000 cc1 monitor cc1 adc this analog to digital converter input pin monitors the usb type-c tm cc1 signal to detect various usb type-c connec- tions. refer to table 3-1 for additional details. cc2 monitor cc2 adc this analog to digital converter input pin monitors the usb type-c cc2 signal to detect various usb type-c connections. see ta b l e 3 - 1 for additional details. digital outputs +5v vbus power supply enable ppc_en o25 dfp modes only. active high output which controls the 5v supply to vbus. this pin only asserts when a valid usb type- c connection is detected. plug orientation indicator plug_orientation# od25 this active low output pin indicates the usb type-c cable plug orientation. this pin remains high in the default unconnected state or when an rd pull-down resistor is detected on cc1 . the pin will assert low when an rd pull-down resistor is detected on cc2 . cc1 vconn supply control vconn1_out# od25 dfp modes only. open drain, active low vconn supply con- trol to cc1 for supplying 5v to active cable circuitry. see section 3.4 vconn supply control (dfp modes only) for additional details. cc2 vconn supply control vconn2_out# od25 dfp modes only. open drain, active low vconn supply con- trol to cc2 for supplying 5v to active cable circuitry. see section 3.4 vconn supply control (dfp modes only) for additional details. audio adapter indicator and control audio_adapter o25 dfp modes only. active high pin which indicates the detection of a usb audio adapter device. th is pin is intended to control a high speed usb and audio switch which toggles between stan- dard usb 2.0 dp/dm signaling and audio signaling. fault indicator fault_ind o25 activ e high fault indicator output. output is asserted after an overcurrent event on ocs # is detected. output is deasserted after toggling the enable input pin or after a power-on reset. connected state indicator connected# od25 ufp mode only. open drain pin which asserts when a valid usb type-c connection is detected on the cc pin, and when vbus is within the valid voltage range. legacy charging indi- cator legacy_ind# od25 ufp mode only. open drain pin which asserts low when a valid usb type-c connection is detected and legacy 500ma/ 900ma charging capability is detected. 1.5a charging indicator 1.5a_ind# od25 ufp mode only. open drain pin which asserts low when a valid usb type-c connection is detected and 1.5a usb type- c charging capability is detected. 3.0a charging indicator 3.0a_ind# od25 ufp mode only. open drain pin which asserts low when a valid usb type-c connection is detected and 3.0a usb type- c charging capability is detected. table 2-2: pin descri ptions (continued) name symbol buffer type description downloaded from: http:///
utc2000 ds00001957c-page 10 ? 2015 microchip technology inc. 2.3 buffer types power and ground power vdd p 5.0v power input. a minimum of one 0.1uf bypass capacitor placed close to the pin is recommended. the high level of all digital outputs will be equivalent to the vdd supply voltage. ground vss p ground. the exposed pad must also be connected to vss / ground. table 2-3: buffer types buffer type description adc analog to digital input is schmitt-triggered input o25 output with 25ma sink and 25ma source od25 open-drain output with 25ma sink and 25ma source pp o w e r pu 100 a (typical) internal pull-up. note: internal pull-up resistors prevent unconnect ed inputs from floating. do not rely on internal resistors to drive signals exte rnal to the device. when connected to a load that must be pulled high, an ex ternal resistor must be added. note: refer to section 4.3, dc characteristics for electrical characteristics. table 2-2: pin descri ptions (continued) name symbol buffer type description downloaded from: http:///
? 2015 microchip technology inc. ds00001957c-page 11 utc2000 3.0 functional description this chapter describes the f unctional descriptions for t he following device sub-systems. section 3.1, configuration selection section 3.2, dfp modes functional state machine section 3.3, ufp mode functional state machine section 3.4, vconn supply control (dfp modes only) section 3.5, usb audio a dapter (dfp modes only) section 3.6, ufp mode connection and charging capability detection indicator section 3.7, connection and disconnection detection debounce 3.1 configuration selection the cfg_sel pin is sampled at power-on at vcfg_samp and the utc2000 is placed in either ufp or dfp modes of operation. if the cfg_sel pin is within one of the dfp mode ranges upon powe r-on, it will operate in dfp mode. while in dfp mode, the cfg_sel pin is constantly monitored and can be placed in any of the dfp modes at any time by the system controller. switching from dfp to ufp modes cannot be achieved without a power-on reset. ta b l e 3 - 1 displays the volt- age ranges for the dfp profile. if the cfg_sel pin is within the ufp mode range upon power-on, it will operate in ufp mode. for ufp designs, it is recommended to tie cfg_sel to vdd through a pull-up resistor to ensure that ufp mode is entered when vdd crosses the por threshold. switchin g from ufp to dfp modes cannot be achieved without a power-on reset. ta b l e 3 - 2 displays the voltage ranges for the ufp profile. table 3-1: dfp configuration selection voltage monitoring thresholds cfg_sel voltage profile cc1/cc2 no connection voltage range cc1/cc2 rd detection voltage range cc1/cc2 ra detection voltage range 1.2v - 1.3v 3a capable dfp 5.0v - 2.75v 2.60v - 0.85v 0.80v - 0.00v 0.7v - 0.8v 1.5a capable dfp 5.0 v - 1.65v 1.60v - 0.45v 0.40v - 0.00v 0.0v - 0.30v default legacy usb capable dfp 5.0v - 1.65v 1.60v - 0.25v 0.20v - 0.00v table 3-2: ufp configuration selection voltage monitoring thresholds cfg_sel voltage no connection voltage range cc1/cc2 legacy charging connection voltage range cc1/cc2 1.5a charging connection voltage range cc1/cc2 3.0a charging connection voltage range 1.75v - vdd 0.0v - 0.25v 0.25v - 0.70v 0.70v-1.31v > 1.31v downloaded from: http:///
utc2000 ds00001957c-page 12 ? 2015 microchip technology inc. 3.2 dfp modes functional state machine a visual representation of the utc2000 df p state machine behavior is shown in figure 3-1 . the various states are detailed in the following sub-sections. figure 3-1: dfp modes state machine diagram 3.2.1 disabled idle the utc2000 will remain in a disabled, inactive state if enable is asserted low, or the voltage on cfg_sel is not within a valid configuration range. while in this state, the state of the digital outputs are as follows: ppc_en : low plug_orientation# : high vconn1_out# : high vconn2_out# : high audio_adapter : low 3.2.2 enabled idle if both enable is asserted high and cfg_sel is in a valid configuration range, the utc2000 will actively monitor the cc1 and cc2 pins for a connect event. while in this state, the state of the digital outputs are as follows: ppc_en : low plug_orientation# : high vconn1_out# : high vconn2_out# : high audio_adapter : low dfp mode cfg_sel = 0.0v C 0.3v (legacy profile) or cfg_sel = 0.7v C 0.8v (1.5a profile) or cfg_sel = 1.2v C1.3v (1.5a profile) connection states enabled idle (no connection detected) ppc_en = low plug_orientation# = high vconn1_out# = high vconn2_out# =high audio adapter = low unflipped passive cable ppc_en = high plug_orientation# = high vconn1_out# = high vconn2_out# = high audio adapter = low unflipped powered cable ppc_en = high plug_orientation# = high vconn1_out# = high vconn2_out# = low audio adapter = low flipped passive cable ppc_en = high plug_orientation# = low vconn1_out# = high vconn2_out# = high audio adapter = low flipped powered cable ppc_en = high plug_orientation# = low vconn1_out# = low vconn2_out# = high audio adapter = low usb audio adapter ppc_en = low plug_orientation# = high vconn1_out# = high vconn2_out# = high audio adapter = high cc1 detects rd cc2 detects nc cc1 detects rd cc2 detects ra cc1 detects nc cc2 detects rd cc1 detects ra cc2 detects rd cc1 detects ra cc2 detects ra fault deassert all outputs set fault_ind high ocs# asserted or vmon > 0.8v (no debounce) ocs# de-asserted and/or vmon < 0.8v connection detected (100ms-200ms debounce) connection lost (10-20ms debounce) enable low > high disabled idle ppc_en = low plug_orientation# = high vconn1_out# = high vconn2_out# =high audio adapter = low enable high > low change detected, transition to new state 10-20ms debounce downloaded from: http:///
? 2015 microchip technology inc. ds00001957c-page 13 utc2000 3.2.3 connected (unflipped passive cable) if both enable is asserted high and cfg_sel is in a valid configuration range and an rd pull-down resistor is sensed on the cc1 pin, the utc2000 will enter the conne cted (unflipped passive cable) state. while in this state, the state of the digital outputs are as follows: ppc_en : high plug_orientation# : high vconn1_out# : high vconn2_out# : high audio_adapter : low 3.2.4 connected (unflipped active cable) if enable is asserted high, cfg_sel is in a valid configuration range, an rd pull-down resistor is sensed on the cc1 pin, and an ra pull-down resistor is sensed on the cc2 pin, the utc2000 will enter the connected (unflipped active cable) state. while in this state, the state of the digital outputs are as follows: ppc_en : high plug_orientation# : high vconn1_out# : high vconn2_out# : low audio_adapter : low 3.2.5 connected (flipped passive cable) if both enable is asserted high and cfg_sel is in a valid configuration range and an rd pull-down resistor is sensed on the cc2 pin, the utc2000 will enter the connected (flipped passive cable) state. while in this state, the state of the digital outputs are as follows: ppc_en : high plug_orientation# : low vconn1_out# : high vconn2_out# : high audio_adapter : low 3.2.6 connected (fli pped active cable) if enable is asserted high, cfg_sel is in a valid configuration range, an rd pull-down resistor is sensed on the cc2 pin, and an ra pull-down resistor is sensed on the cc1 pin, the utc2000 will enter the connected (unflipped active cable) state. while in this state, the state of the digital outputs are as follows: ppc_en : high plug_orientation# : low vconn1_out# : low vconn2_out# : high audio_adapter : low downloaded from: http:///
utc2000 ds00001957c-page 14 ? 2015 microchip technology inc. 3.2.7 connected (usb audio adapter) if enable is asserted high, cfg_sel is in a valid configuration range, and ra pull-down resistors are sensed on both cc1 and cc2 pins the utc2000 will enter the conne cted (unflipped active cable) state. while in this state, the state of the digital outs are as follows: ppc_en : low plug_orientation# : high vconn1_out# : high vconn2_out# : high audio_adapter : high 3.2.8 fault (overcurrent or overvoltage) if ocs# is asserted low while in any state, the utc2000 will set all of its outputs to the default state and will transition into the fault state. an internal overcurrent flag will be set and fault_ind will drive high. normal operation will resume after ocs# is deasserted. the fault_ind pin will continue to drive low until a power cycle occurs. if vmon exceeds 0.8v at any state, the utc20 00 will set all of its outputs to the default state and will transition into the fault state. an internal overvoltage flag will be set and fault_ind will drive high. normal operation will resume after vmon is deasserted. the fault_ind pin will continue to drive low until a power cycle occurs. note: a typical usb audio adapter device will simply short cc1 and cc2 to ground. this implementation is func- tionally equivalent to using two ra resistors. downloaded from: http:///
? 2015 microchip technology inc. ds00001957c-page 15 utc2000 3.3 ufp mode functional state machine a visual representation of the utc2000 uf p state machine behavior is shown in figure 3-2 . the various states are detailed in the following sub-sections. figure 3-2: ufp mode state machine diagram 3.3.1 idle the utc2000 will remain in a disabled, inactive state if enable is asserted low, or the voltage on cfg_sel is not within a valid configuration range. while in this state, the state of the digital outputs are as follows: connected# : high (not asserted) plug_orientation# : high (not asserted) legacy_ind# : high (not asserted) 1.5a_ind# : high (not asserted) 3.0a_ind# : high (not asserted) ufp mode cfg_sel = 1.75v C vdd idle (no connection detected) connected# = high plug_orientation# = high legacy_ind# = high 1.5a_ind# = high 3.0a_ind# = high fault deassert all outputs set fault_ind high ocs# asserted or vmon > 0.8v (no debounce) ocs# de-asserted and/or vmon < 0.8v connection states 0.5 < vmon < 0.6875v (4.0 < vbus < 5.5v) unflipped legacy connection connected# = low plug_orientation# = high legacy_ind# = low 1.5a_ind# = high 3.0a_ind# = high unflipped 1.5a connection connected# = low plug_orientation# = high legacy_ind# = high 1.5a_ind# = low 3.0a_ind# = high unflipped 3.0a connection connected# = low plug_orientation# = high legacy_ind# = high 1.5a_ind# = high 3.0a_ind# = low flipped legacy connection connected# = low plug_orientation# = low legacy_ind# = low 1.5a_ind# = high 3.0a_ind# = high fllipped 1.5a connection connected# = low plug_orientation# = low legacy_ind# = high 1.5a_ind# = low 3.0a_ind# = high cc1 detects legacy cc2 detects nc cc1 detects 1.5a cc2 detects nc cc1 detects 3.0a cc2 detects nc cc1 detects nc cc2 detects legacy cc1 detects nc cc2 detects 1.5a fllipped 3.0a connection connected# = low plug_orientation# = low legacy_ind# = high 1.5a_ind# = high 3.0a_ind# = low cc1 detects nc cc2 detects 3.0a connection detected (100-150ms debounce) connection lost (10-20ms debouce) change detected, transition to new state 10-20ms debounce downloaded from: http:///
utc2000 ds00001957c-page 16 ? 2015 microchip technology inc. 3.3.2 connected (unflipped legacy connection) if vbus is in a valid range (4.5v-5.5v) and a legacy rp pull-up resistor is sensed on the cc1 pin (and no connection detected on the cc2 pin) the utc2000 will enter the connect ed (unflipped legacy connection) state. while in this state, the state of the digital outputs are as follows: connected# : low (asserted) plug_orientation# : high (not asserted) legacy_ind# : low (asserted) 1.5a_ind# : high (not asserted) 3.0a_ind# : high (not asserted) 3.3.3 connected (unfli pped 1.5a connection) if vbus is in a valid range (4.5v-5.5v) and a 1.5a rp pull-up resistor is sensed on the cc1 pin (and no connection detected on the cc2 pin) the utc2000 will enter the connect ed (unflipped 1.5a connection) state. while in this state, the state of the digital outputs are as follows: connected# : low (asserted) plug_orientation# : high (not asserted) legacy_ind# : high (not asserted) 1.5a_ind# : low (asserted) 3.0a_ind# : high (not asserted) 3.3.4 connected (unfli pped 3.0a connection) if vbus is in a valid range (4.5v-5.5v) and a 3.0a rp pull-up resistor is sensed on the cc1 pin (and no connection detected on the cc2 pin) the utc2000 will enter the connect ed (unflipped 3.0a connection) state. while in this state, the state of the digital outputs are as follows: connected# : low (asserted) plug_orientation# : high (not asserted) legacy_ind# : high (not asserted) 1.5a_ind# : high (not asserted) 3.0a_ind# : low (asserted) 3.3.5 connected (flipped legacy connection) if vbus is in a valid range (4.5v-5.5v) and a legacy rp pull-up resistor is sensed on the cc2 pin (and no connection detected on the cc1 pin) the utc2000 will enter the connect ed (flipped legacy connection) state. while in this state, the state of the digital outputs are as follows: connected# : low (asserted) plug_orientation# : low (asserted) legacy_ind# : high (asserted) 1.5a_ind# : high (not asserted) 3.0a_ind# : high (not asserted) downloaded from: http:///
? 2015 microchip technology inc. ds00001957c-page 17 utc2000 3.3.6 connected (flipped l1.5a connection) if vbus is in a valid range (4.5v-5.5v) and a 1.5a rp pull-up resistor is sensed on the cc2 pin (and no connection detected on the cc1 pin) the utc2000 will enter the conne cted (flipped 1.5a connection) state. while in this state, the state of the digital outputs are as follows: connected# : low (asserted) plug_orientation #: low (asserted) legacy_ind# : high (not asserted) 1.5a_ind# : low (asserted) 3.0a_ind# : high (not asserted) 3.3.7 connected (flipped 3.0a connection) if vbus is in a valid range (4.5v-5.5v) and a 3.0a rp pull-up resistor is sensed on the cc2 pin (and no connection detected on the cc1 pin) the utc2000 will enter the conne cted (flipped 3.0a connection) state. while in this state, the state of the digital outputs are as follows: connected# : low (asserted) plug_orientation# : low (asserted) legacy_ind# : high (not asserted) 1.5a_ind# : high (not asserted) 3.0a_ind# : low (asserted) 3.3.8 fault (overcurrent or overvoltage) if ocs# is asserted low while in any state, the utc2000 will set all of its outputs to the default state and will transition into the fault state. an internal overcurrent flag will be set and fault_ind will drive high. normal operation will resume after ocs# is deasserted. the fault_ind pin will continue to drive low until a reset or power cycle occurs. if vmon exceeds 0.8v (6.4v on vbus) at any state, the utc2000 will set all of it s outputs to the default state and will transition into the fault state. an internal overvoltage flag will be set and fault_ind will drive high. normal operation will resume after vmon is deasserted. the fault_ind pin will continue to drive low until a reset or power cycle occurs. 3.4 vconn supply control (dfp modes only) vconn1_out# and vconn2_out# are open drain, active low output signals used to control a 5v voltage supply to power a powered usb type-c cable. powered cable support is mandatory for all usb type-c applications which imple- ment usb 3.0/usb 3.1. for usb 2.0 sy stems, powered cable support is optional. the vconn supply control signals will assert low when one of the following conditions are met: vconn1_out# will assert low if an rd resistor is detected on cc2 and an ra resistor is detected on cc1 . the signal will remain asserted until the rd resistor on cc2 is no longer sensed (usb cable is detached). vconn2_out# will assert low if an rd resistor is detected on cc1 and an ra resistor is detected on cc2 . the signal will remain to asserted until the rd resistor on cc1 is no longer sensed (usb cable is detached). 3.5 usb audio adapter (dfp modes only) audio_adapter is an active high output signal that is us ed to indicate when a usb audio adapter is detected. audio_adapter will assert high when an ra resistor is detected on both cc1 and cc2 pins. the signal will remain asserted until either or both ra resistors is no longer sensed. this signal is in tended to control a high-speed switch that toggles between usb differential data and an audio signal.t he switch that is selected must be capable of supporting usb 2.0 as well as audio signals ranging from -3.0v to +3.0v. additional electrical details can be found in section a-3 of the usb type-c tm cable and connector specification . note: additional details for implementing audio ad apter mode are detailed in appendix a of the usb type-c tm cable and connector specification. downloaded from: http:///
utc2000 ds00001957c-page 18 ? 2015 microchip technology inc. two additional signals are also used when operating in audio adapter mode. these signals are mic/agnd and agnd/ mic which should be connected to sbu1 and sbu2 respectively. 3.6 ufp mode connection and charging capability detection indicator while operating in ufp mode, there are 4 outputs that indicate connection state. connected# is an open drain output that asserts when any of the three valid usb type- c connections are detected. legacy charging mode (500ma for usb 2.0 connections, 9 00ma for usb 3.0/usb 3.1 con nections) is detected when a dfp with a 56k rp pull-up resistor is detected. 1.5a ch arging is detected when a dfp with a 22k rp pull-up resistor is detected. 3.0a charging is detected when a dfp with a 10k rp pull-up resistor is detected. the legacy_ind# , 1.5a_ind# , and 3.0a_ind# open drain outputs assert low to indicate which type of connection was detected. these outputs can be fed to the battery charging manageme nt circuitry of the usb device to appropriately regulate the amount of current draw. the connected# signal may also be used to gate the vbus voltag e to system power if an added level of protection from high voltage is desired. 3.7 connection and disconnection detection debounce a debounce is implemented to eliminat e unwanted connect/disconnect events due to cable jostling or usb power deliv- ery messaging. a transition from the enabled idle state to any connected state is debounced by 100ms-200ms. a transition from any connected state to any other c onnected state or from any connected state to the enabled idle state is debounced by 10ms-20ms. downloaded from: http:///
? 2015 microchip technology inc. ds00001957c-page 19 utc2000 4.0 operational characteristics 4.1 absolute maximum ratings (?) ambient temperature under bias................................................................................................. ........... -40c to +125c storage temperature ............................................................................................................ .................. -65c to +150c voltage on pins with respect to v ss on v dd pin ........................................................................................................................... ....... -0.3v to +6.5v on all other pins ............................................................................................................. . -0.3v to (v dd + 0.3v) maximum current on v ss pin ( 4-1 ) 0c t a +70c ..................................................................................................................... 95 ma -40c t a +85c .................................................................................................................. 85 ma -40c t a +125c ................................................................................................................ 35 ma on v dd pin(1) 0c t a +70c ..................................................................................................................... 95 ma -40c t a +85c .................................................................................................................. 85 ma -40c t a +125c ................................................................................................................ 35 ma on any i/o pin ................................................................................................................ ....................... 25 ma clamp current, i k (v pin < 0 or v pin > v dd ) ......................................................................................................... 20 ma note 4-1 maximum current rating requires ev en load distribution across i/o pins. maximum current rating may be limited by the device package power dissipation characterizations. 4.2 standard operating conditions the standard operating conditions for this device are defined as: operating voltage: v ddmin v dd v ddmax operating temperature: t a _ min t a t a _ max v dd operating supply voltage ( 4-2 ) v ddmin ............................................................................................................................... ........ +4.5v v ddmax ............................................................................................................................... ....... +5.5v t a operating ambient temperature range commercial temperature t a _ min ............................................................................................................................... ............ 0c t a _ max ............................................................................................................................... ....... +70c industrial temperature t a _ min ............................................................................................................................... ......... -40c t a _ max ............................................................................................................................... ....... +85c extended temperature t a _ min ............................................................................................................................... ......... -40c t a _ max ............................................................................................................................... ..... +125c note 4-2 refer to parameter d001 , dc characteristics: supply voltage. ? notice: stresses above those listed under absolute maximum ratings may cause permanent damage to the device. this is a stress rating only and functional operation of the device at those or any other conditions above those indicated in the operation listings of th is specification is not im plied. exposure above maximum rating conditions for extended periods may affect device reliability. downloaded from: http:///
utc2000 ds00001957c-page 20 ? 2015 microchip technology inc. 4.3 dc characteristics figure 4-1: por and por rearm with slow rising v dd table 4-1: supply voltage param. no. sym. characteristic min. typ? max. units conditions d001 vdd supply voltage vddmin 4.5 vddmax 5.5 v d002* v por power-on reset release voltage (1) 1 . 6 v d003 v porr * power-on reset rearm voltage (1) 0 . 8 v d004 s vdd v dd rise rate (2) 0.05 v/ms ensures that the power-on reset signal is released properly. d005 v cfg _ samp cfg_sel sampling threshold voltage 3 . 6 v * these parameters are characterized but not tested. note 1: see figure 4-1 , por and por rearm with slow rising v dd . v dd v por v porr v ss v ss npor (1) t por (2) por rearm note 1: when npor is low, the device is held in reset. 2: t por 1 s typical. 3: t vlow 2.7 s typical. t vlow (3) s vdd downloaded from: http:///
? 2015 microchip technology inc. ds00001957c-page 21 utc2000 table 4-2: supply current (i dd ) (1) param. no. device characteristics min. typ max. units conditions v dd note d006 disabled 185 205 ua 5.0 -40c t a +85c d007 enabled 185 205 ua 5.0 -40c t a +85c d008 enabled & connected 1.30 1.35 ma 5.0 -40c t a +85c note 1: the supply current is mainly a function of the operatin g voltage. other factors, such as i/o pin loading and switching rate also have an im pact on the current consumption. table 4-3: i/o ports standard operating conditions (unless otherwise stated) param. no. sym. characteristic min. typ? max. units conditions v il input low voltage i/o port: d009 0.8 v 4.5v v dd 5.5v d009a 0.15 v dd v 3.0v v dd 4.5v v ih input high voltage d010 2.0 v 4.5v v dd 5.5v d010a 0.25 v dd + 0.8 v 3.0v v dd 4.5v i il input leakage current (1) d011 i/o ports 5 125 na v ss v pin v dd , pin at high-impedance, 85c 5 1000 na v ss v pin v dd , pin at high-impedance, 125c v ol output low voltage d012 i/o ports 0.6 v iol = 8 ma, vdd = 5v iol = 6 ma, vdd = 3.3v iol = 1.8 ma, vdd = 1.8v voh output high voltage d013 i/o ports vdd - 0.7 v ioh = 3.5 ma, vdd = 5v ioh = 3 ma, vdd = 3.3vioh = 1 ma, vdd = 1.8v capacitive loading specifications on output pins d014* cio all i/o pins 50 pf * these parameters are characterized but not tested. ? data in typ column is at 5.0v, 25c unless otherwise stated. these parameters are for design guidance only and are not tested. note 1: negative current is defined as current sourced by the pin. downloaded from: http:///
utc2000 ds00001957c-page 22 ? 2015 microchip technology inc. table 4-5: thermal characteristics table 4-4: timing parameters standard operating conditions (unless otherwise stated) param. no. sym. min. typ? max. units t connect_debounce cc1/cc2 connection detection debounce delay d015 100 160 200 ms t disconnect_debounce cc1/cc2 disconnection or connection change debounce delay d016 10 16 20 ms t vmon_fault vmon fault detection reaction delay d017 0.460 1 ms t ocs#_fault ocs# fault detection reaction delay d018 0.410 1 ms ? data in typ column is at 3.0v, 25c unless otherwise stated. standard operating conditions (unless otherwise stated) param. no. sym. characteristic typ. units conditions th01 ja thermal resistance junction to ambient 55.3 c/w 16-pin qfn 3x3x0.9mm package th02 jc thermal resistance junction to case 10 c/w 16-pin qfn 3x3x0.9mm package th03 t jmax maximum junction temperature 150 c th04 pd power dissipation w pd = p internal + p i / o th05 pinternal internal power dissipation w p internal = i dd x v dd (1) th06 p i / o i/o power dissipation w p i / o = (i ol * v ol ) + (i oh * (v dd - v oh )) th07 p der derated power w p der = pd max (t j - t a )/ ja (2) note 1: i dd is current to run the chip alone wit hout driving any load on the output pins. 2: t a = ambient temperature; t j = junction temperature downloaded from: http:///
? 2015 microchip technology inc. ds00001957c-page 23 utc2000 5.0 utc2000 system application this chapter explains external requirements for ut c2000 applications and provides some example diagrams. section 5.1, 5v vbus switch (dfp modes only) section 5.2, rp pull-up resistor (dfp modes only) section 5.3, rd pull-down resistor (ufp mode only) section 5.4, vconn active c able supply (dfp modes only) section 5.5, cc pin isolation (dfp only) section 5.6, cc pin current limiting resistors (ufp only) section 5.7, vbus monitoring section 5.8, usb signal multiplexer section 5.9, application example: 3.0a capable usb 3.0/usb 3.1 dfp section 5.10, application exampl e: 1.5a capable usb 2.0 dfp section 5.11, application example: 500ma cap able usb 2.0 dfp with audio adapter support section 5.12, application example: 3.0a cap able usb type-ctm charging port (ac adapter) section 5.13, application example: ufp device 5.1 5v vbus switch (dfp modes only) a 5v usb port power switch with active high enable input and an overcurrent indicator output is required. the usb type-c receptacle must not supply 5v to the vbus pins until a valid connection is detected. the utc2000 controller asserts the active high ppc_en signal to control the 5v port power supply to vbus upon detection of a valid usb type- c connection. the port power switch cont rolled by the utc2000 shall also have built in overcurrent detection set to a threshold that is appropriate for the current capability profile that is being selected per ta b l e 5 - 1 . an overcurrent thresh- old of 125% (of the selected dfp profile current) is appropriate, as the threshold may not be tripped at any current less than or equal to the selected current profile. the 5v vbus port power controller should indicate that an overcurrent event has occurred by pulling the ocs# signal to the utc2000 controller low. 5.2 rp pull-up resistor (dfp modes only) a downstream facing port is required to supply voltage to both cc pins through a pull-up resistor. the pull-up voltage may be either 5.0v volts or 3.3v. a ufp must implement a rd pull-down resistor to ground. when a dfp to ufp con- nection is made, a resistor divider is formed, and the vo ltage at the cc pin can be measur ed to interpret the type of connection. ta b l e 5 - 1 describes the possible values of the rp pull-up resistor. the utc2000 measures the voltages on both cc pins via it s internal adcs. the cc pin voltage ranges, as defined in the usb type-c tm cable and connector specification , are shown in ta b l e 3 - 1 . 5.3 rd pull-down resistor (ufp mode only) an upstream facing port is required to implement a 5.1k +/- 10% rd pull-down resistor to ground connected to both cc1 and cc2 pins on the type-c receptacle. when a dfp to ufp connection is made, a resistor divider is formed, and the voltage at the cc pin can be measured to in terpret the charging capability of the dfp. note: a constant current source may also be implemented instead of a pull-up resistor. table 5-1: rp pull-up resistor values dfp advertisement resistor pull-up to 4.75 - 5.5v resistor pull-up to 3.3v 5% current source legacy usb: 500ma usb 2.0 900ma usb 3.0/usb 3.1 56 k ? 20% 36 k ? 20% 80 a 20% 1.5a 22 k ? 5% 12 k ? 5% 180 a 8% 3.0a 10 k ? 5% 4.7 k ? 5% 330 a 8% downloaded from: http:///
utc2000 ds00001957c-page 24 ? 2015 microchip technology inc. 5.4 vconn active cable supply (dfp modes only) all usb type-c receptacles must be able to supply power to an active cable if usb 3.0/usb 3.1 signaling is imple- mented. supplying vconn is optional if only usb 2.0 is implemented. the simplest implementation is to add a fet (or series of fets) that switches in the vconn voltage dire ctly to the cc pin node. the vconn supply must be capable of supplying 1.0w of continuous power and may not supply more than 1.25a at the moment of plug contact. a bulk capacitance of 10f to 220f must also be switched in with vconn. the bulk capacitance may not need to be a dis- crete capacitor if the supplys output capacitance already meets this requirement. overcurrent detection is recom- mended, but not required per the usb type-c tm cable and connector specification . a simple implementation example is shown in figure 5-1 below. figure 5-1: example vconn supply connection 5.5 cc pin isolation (dfp only) the cc pins on a dfp must be high-impedance when the dfp is powered off. this is to prevent vbus backdrive in a situation when a dfp connects to an unpowered dfp and detec ts the rp pull-up resistors as an rd pull-down. there- fore, it is recommended that some isol ation fets are implemented that disconnect the cc pins from the rp pull-up resis- tors and vconn supply circuitry when powered off. 5.6 cc pin current limiting resistors (ufp only) because most ufp designs require operation even when unpowered, resistors placed directly in front of the cc1 and cc2 pins are recommended to limit the amount of leakage current through the utc2000 adc inputs when unpowered. 10k ? resistors are the recommended value. failure to place current limiting resistors could result in a failure to detect a usb attach due to a shift in cc voltage. note: rds_on must be carefully considered to ensure that the usb type-c tm cable and connector specification requirements for vconn supply current and voltage range are met. note: it is also recommended to implement additional circui try to make the cc1 and cc2 pins high impedance when the dfp is in an unpowered state. refer to figure 5-7 for an example. vconn1_out#vconn2_out# rp pull-up voltage cc1cc2 rp rp 10uf-220ufbulk cap vconn 1.0w supply downloaded from: http:///
? 2015 microchip technology inc. ds00001957c-page 25 utc2000 5.7 vbus monitoring dfp modes: an optional vbus monitoring function may be im plemented to protect the system from higher than expected voltages on vbus (from a malfunctioning connect ed usb device) by preventing the utc2000 from enabling the 5v port switch. additional back-drive protection or is olation circuitry must be impl emented for thorough protection. this feature requires the vmon pin to be connected to vbus through a resistor divider network that divides the vbus voltage by a factor of 8. a 35.7k ? resistor over a 5.1k ? resistor is recommended, as shown in the figure 5-7 , figure 5- 8 , and figure 5-9 below. ufp mode: the vbus monitoring function is required and used to verify a valid vbus range before asserting the con- nected pin or any charge capability indicator outputs. a f ault condition will also be flagged if higher than expected voltage on vbus (from a malfunctioning connected usb device) is detected. additional back-drive protection or isola- tion circuitry must be implemented for thorou gh protection. this fe atures requires the vmon pin to be connected to vbus through a resistor divider network that divides the vbus voltage by a factor of 8. 5.8 usb signal multiplexer there are several options for connecting the usb signals to the usb type-c receptacles. these options differ slightly between usb 2.0 and usb 3.0/usb 3.1 applications , as detailed in the following sub-sections. 5.8.1 usb 2.0 option 1: hi gh-speed multiplexer/switch the most robust solution for usb 2.0 applications is to us e a usb high-speed switch to co ntrol the routing of the usb signals. the microchip usb3740 is a cost-effective so lution for this purpose and offers several benefits: extreme esd: +- 15kv (iec) low power: 5ua(on), 1ua (off) off isolation: less than -40db high bandwidth: up to 1 ghz preserves signal integrity small package: 1.3 x 1.8 mm C 10pin dfn (.4mm pitch) figure 5-2: block diagram of usb 2.0 option 1: high-speed switch microchip usb 3740 switch usb2.0 host/ hub/ device usb type-c tm connector dp dm dp dm dp1 dm1 dp2 dp2 s plug_orientation# (from utc2000) a6 a7 b6 b7 d+ d- d+ d- dp dm dp dm downloaded from: http:///
utc2000 ds00001957c-page 26 ? 2015 microchip technology inc. 5.8.2 usb 2.0 option 2: short dp/dm pins together the simplest solution is to short together the dp / dm pins at the receptacle. only one dp / dm pair at the connector will be active at once. note that this implementation will negat ively affect the integrity of the usb signals because of the creation of stubs on the usb traces. figure 5-3: block diagram of usb 2.0 option 2: short dp/dm pins together 5.8.3 usb 2.0 option 3: use two downstream ports (dfp only) if two downstream ports are available, then they may both be connected to the dp / dm pins on the usb type-c recep- tacle. only one of the ports will be active and able to be used at once. figure 5-4: block diagram of usb 2.0 option 3: use two downstream ports note: if using a microchip hub with flexconnect, a muxless ufp design is possible. refer to the microchip usb5734 usb type-c reference design and evaluation platform for details. usb2.0 host/ hub/ device dp dp dm a6 a7 b6 b7 d+ d- d+ d- dm usb host/ hub usb type-c tm connector dp1 dm1 dp2 dp2 a6 a7 b6 b7 d+ d- d+ d- dp dm downloaded from: http:///
? 2015 microchip technology inc. ds00001957c-page 27 utc2000 5.8.4 usb 3.0/usb 3.1 option 1: super speed mult iplexer/switch in a usb 3.0/usb 3.1 ufp application, or a usb 3.0/usb 3.1 dfp application where only one downstream port is avail- able, a super-speed usb 3.0/usb 3.1 switch must be used to control the routing of the usb signals. figure 5-5: block di agram of usb 3.0/usb 3.1 opti on 1: super-speed mux/switch usb3.0/ usb 3.1 super-speed mux usb 3.0/ usb 3.1 host/ hub/ device usb type-c tm connector dp dm dp dm s plug_orientation# (from utc2000) a6 a7 b6 b7 d+ d- d+ d- ssrx+ ssrx- ssrx+ ssrx- sstx+ sstx- sstx+ sstx- dp dm ssrx1+ ssrx1- sstx1+ sstx1- dp dm ssrx2+ ssrx2- sstx2+ sstx2- b11 b10 rx1- rx1+ a2 a3 tx1- tx1+ b11 b10 rx1- rx1+ a2 a3 tx1- tx1+ downloaded from: http:///
utc2000 ds00001957c-page 28 ? 2015 microchip technology inc. 5.8.5 usb 3.0/usb 3.1 option 2: use two downstream ports (dfp only) if two downstream ports are available, then they may both be connected to the us b pins on the usb type-c receptacle. only one of the ports will be active and able to be used at once. figure 5-6: block diagram of usb 3.0/usb 3.1 option 2: use two downstream ports note: if using a microchip hub with flexconnect, a muxless ufp design is possible. refer to the microchip usb5734 type-c reference design and evaluation platform for details. usb 3.0/ usb 3.1 host/ hub usb type-c tm connector dp a6 a7 b6 b7 d+ d- d+ d- dp1 dm1 ssrx1+ ssrx1- sstx1+ sstx1- dp2 dm2 ssrx2+ ssrx2- sstx2+ sstx2- b11 b10 rx1- rx1+ a2 a3 tx1- tx1+ b11 b10 rx1- rx1+ a2 a3 tx1- tx1+ downloaded from: http:///
? 2015 microchip technology inc. ds00001957c-page 29 utc2000 5.9 application example: 3.0a capable usb 3.0/usb 3.1 dfp figure 5-7: usb 3.0/usb 3.1 application schematic x) 9 )urp+rvw+xe 9b,1 (1$%/( 9b287 2&6 3ruw3rzhu&rqwuroohu 9 n 86%'386%'0 *1' 7; $ 7; $ && $ ' $ ' $ 6%8 $ 5; $ 5; $ 7; % 7; % && % ' % ' % 6%8 % 9%86 5; % 5; % 86%7\sh & 7r62& 9 9 7; 5; 6 7;$ 5; 7;$ 5;$ 5;$ 7;% 7;% 5;% 5;% 7; 86%6zlwfk 86%5;86%5; 86%7; 86%7; n n && 9'' 966 (3$' 9021 && 9&211b287 9&211b287 2&6 (1$%/( $8',2b$'$37(5 3/8*b25,(17$7,21 )$8/7b,1' &)*b6(/ 33&b(1 87& 9 n n 9 n 9 ,vrodwlrq)(7vzkhqxqsrzhuhg 9&211 9&211 n n 389rowdjh tm downloaded from: http:///
utc2000 ds00001957c-page 30 ? 2015 microchip technology inc. 5.10 application example: 1.5a capable usb 2.0 dfp figure 5-8: usb 2.0 application schematic 5.11 application example: 500ma capable usb 2.0 dfp with audio adapter support figure 5-9: usb 2.0 with audio adapter application schematic x) 9 )urp+rvw+xe 9b,1 (1$%/( 9b287 2&6 3ruw3rzhu&rqwuroohu 9 n 86%'386%'0 *1' 7; $ 7; $ && $ ' $ ' $ 6%8 $ 5; $ 5; $ 7; % 7; % && % ' % ' % 6%8 % 9%86 5; % 5; % 86%7\sh & 9 n 9 n 7r62& 9 9 n n && 9'' 966 (3$' 9021 && 9&211b287 9&211b287 2&6 (1$%/( $8',2b$'$37(5 3/8*b25,(17$7,21 )$8/7b,1' &)*b6(/ 33&b(1 87& 9 ,vrodwlrq)(7vzkhqxqsrzhuhg 9&211rswlrqdoiru86%v\vwhpv tm x) 9 )urp+rvw+xe '3 '0 $8',2b/ $8',2b5 '3 '0 9'' *1' 6 86%$xglr6zlwfk 9b,1 (1$%/( 9b287 2&6 3ruw3rzhu&rqwuroohu 9 n 9 86%'386%'0 $8',2/$8',25 *1' 7; $ 7; $ && $ ' $ ' $ 6%8 $ 5; $ 5; $ 7; % 7; % && % ' % ' % 6%8 % 9%86 5; % 5; % 86%7\sh & 7r62& 9 0lf$*1'$*1'0lf n n 9 n 9 n 9 ,vrodwlrq)(7vzkhqxqsrzhuhg 9&211rswlrqdo iru86%v\vwhpv && 9'' 966 (3$' 9021 && 9&211b287 9&211b287 2&6 (1$%/( $8',2b$'$37(5 3/8*b25,(17$7,21 )$8/7b,1' &)*b6(/ 33&b(1 87& tm downloaded from: http:///
? 2015 microchip technology inc. ds00001957c-page 31 utc2000 5.12 application example: 3.0a capable usb type-c tm charging port (ac adapter) figure 5-10: 3.0a charging port ( ac adapter) application schematic 5.13 application example: ufp device figure 5-11: ufp device application schematic x) 9 9b,1 (1$%/( 9b287 2&6 3ruw3rzhu&rqwuroohu 9 n *1' 7; $ 7; $ && $ ' $ ' $ 6%8 $ 5; $ 5; $ 7; % 7; % && % ' % ' % 6%8 % 9%86 5; % 5; % 86%7\sh & 9 9 n n && 9'' 966 (3$' 9021 && 9&211b287 9&211b287 2&6 (1$%/( $8',2b$'$37(5 3/8*b25,(17$7,21 )$8/7b,1' &)*b6(/ 33&b(1 87& 9 7r3:50dqdjhphqw 9 n 9 n 9 ,vrodwlrq)(7vzkhqxqsrzhuhg tm 0.1uf 5v r_sense gnd tx1+ a2 tx1- a3 cc1 a5 d+ a6 d- a7 sbu1 a8 rx2- a10 rx2+ a11 tx2+ b2 tx2- b3 cc2 b5 d+ b6 d- b7 sbu2 b8 vbus rx1- b10 rx1+ b11 usb type c 5v 10k to pwr management 5.1lk 5.1k tx- rx+ s tx-a rx- tx+a rx-a rx+a tx+b tx-b rx-b rx+b tx+ usb3.0 switch usb2 dp usb2 dm usb3 rx- usb3 rx+ usb3 tx- usb3 tx+ cc1 7 vdd 16 vss 13 epad vmon 12 cc2 6 1.5a_ind# 9 legacy_ind# 8 ocs# 1 enable 3 connected# 5 plug_orientation# 11 fault_ind 4 cfg_sel 2 3.0a_ind# 10 utc2000 + - ocs current sense to pwr management to pwr management to pwr management 35.7k 5.1k to system power 5v 10k 10k 10k 10k downloaded from: http:///
utc2000 ds00001957c-page 32 ? 2015 microchip technology inc. note: the pass fet and current sense circuitry connected to vbus are for high voltage protection and are optional. if high voltage protection is required and th e device is bus powered or battery powered (and may have a dead battery), a high voltage tolerant regu lator must also be implemented to power the utc2000 while it qualifies the usb type-c connection. downloaded from: http:///
? 2015 microchip technology inc. ds00001957c-page 33 utc2000 6.0 packaging information 6.1 package marking information figure 6-1: 16-pin qfn p ackage marking information note: for the most current package drawings, please se e the microchip packaging specification located at http://www.microchip.com/packaging legend: uc utc2000 designator x temperature range designator: (blank=commercial, i =industrial, e = extended) a automotive designator (0=non-automotive, v=automotive) yy year code (last two digits of calendar year) ww week code (week of january 1 is week 01) nnn alphanumeric traceability code note: in the event the full microchip part nu mber cannot be marked on one line, it will be carried over to the next line, th us limiting the number of available characters for custom er-specific information. example pin 1 pin 1 16-lead qfn (3x3x0.9 mm) downloaded from: http:///
utc2000 ds00001957c-page 34 ? 2015 microchip technology inc. 6.2 package details figure 6-2: 16-pin qfn package (drawing) downloaded from: http:///
? 2015 microchip technology inc. ds00001957c-page 35 utc2000 figure 6-3: 16-pin qfn package (dimensions) downloaded from: http:///
utc2000 ds00001957c-page 36 ? 2015 microchip technology inc. figure 6-4: 16-pin qfn package (land pattern) downloaded from: http:///
? 2015 microchip technology inc. ds00001957c-page 37 utc2000 appendix a: data sheet revision history table a-1: revision history revision level & date section/figure/entry correction ds00001957c (08-06-15) cover, section 1.1, "general description" , section 4.2, "standard operating condi- tions" , figure 6-1 , product identification system on page 40 changed automotive extended temperature to extended temperature as the extended temperature range is av ailable in automotive and non-automotive versions. updated xxx automotive code description. table 2.2, "pin descriptions" updated first sentence of cfg_sel description section 3.1, "configuration selection" updated first sentence to reference v cfg _ samp updated 2nd and 3rd paragraph to make the mode ranges conditional upon power-on. added new sentence to third paragraph: for ufp designs, it is recommended to tie cfg_- sel to vdd through a pull-up resistor to ensure that ufp mode is entered when vdd crosses the por threshold. figure 3-1: dfp modes state machine diagram on page 12 , figure 3-2: ufp mode state machine dia- gram on page 15 , figure 5-11: ufp device applica- tion schematic on page 31 updated figures table 3-1, "dfp configura- tion selection voltage moni- toring thresholds" , table 3- 2, "ufp configuration selection voltage monitoring thresholds" updated cfg_sel voltage column values table 4-1, "supply voltage" added v cfg _ samp parameter table 4-2, "supply current (idd)(1)" added supply current numbers table 4-3, "i/o ports" removed text from characteristics column of d008 and d009 rows updated voltage to 5.0v in footer table 4-4, "timing parame- ters" added new timing parameters table figure 5-3: block dia- gram of usb 2.0 option 2: short dp/dm pins together on page 26 corrected errant blue box around usb type-c connector ds00001957b (07-30-15) product identification sys- tem on page 40 automotive extended changed to extended downloaded from: http:///
utc2000 ds00001957c-page 38 ? 2015 microchip technology inc. figure 1-2, "typical ufp application block diagram" and figure 5-11, "ufp device application sche- matic" figures modified to include cc1/cc2 inputs table 2.2, "pin descriptions" configuration selection and fault indicator descrip- tions modified section 3.1, "configuration selection" , section modified section 3.7, "connection and disconnection detection debounce" and section 5.6, "cc pin current limiting resistors (ufp only)" sections added document release, confidential removed from document footer ds00001957a (06-25-15) all initial preliminary release revision level & date section/figure/entry correction downloaded from: http:///
? 2015 microchip technology inc. ds00001957c-page 39 utc2000 the microchip web site microchip provides online support via our www site at www.microchip.com . this web site is used as a means to make files and information easily available to customers. accessible by using your favorite internet browser, the web site con- tains the following information: product support C data sheets and errata, application notes and sample programs, design resources, users guides and hardware support documents, latest software releases and archived software general technical support C frequently asked questions (faq), te chnical support requests, online discussion groups, microchip consultant program member listing business of microchip C product selector and ordering guides, latest microchip press releases, listing of semi- nars and events, listings of microchip sales offi ces, distributors and factory representatives customer change notification service microchips customer notification service helps keep customers current on microc hip products. subscribers will receive e-mail notification whenever there are changes, updates, revisi ons or errata related to a specified product family or development tool of interest. to register, access the microchip web site at www.microchip.com . under support, click on customer change notifi- cation and follow the registration instructions. customer support users of microchip products can receive assistance through several channels: distributor or representative local sales office field application engineer (fae) technical support customers should contact their distributor, representative or field application engineer (fae) for support. local sales offices are also available to help customers. a listing of sales offices and locations is included in the back of this docu- ment. technical support is available through the web site at: http://www.microchip.com/support downloaded from: http:///
utc2000 ds00001957c-page 40 ? 2015 microchip technology inc. product identification system to order or obtain information, e.g., on pricing or de livery, refer to the factory or the listed sales office . part no. [x] /xx package temperature range device device: utc2000 tape and reel option: blank = standard packaging (tube or tray) t = tape and reel ( 1 ) temperature range: blank = 0 c to +70 c (commercial) i= - 4 0 c to +85 c (industrial) e= - 4 0 c to +125 c (extended) package: mg = 16-pin qfn (3x3x0.9mm) automotive: blank = non-automotive xxx = automotive (3 character internal designator) examples: a) utc2000/mg standard packaging, commercial temperature, 16-pin qfn package b) utc2000t-i/mg tape and reel, industrial temperature, 16-pin qfn package c) utc2000-e/mg042 standard packaging, automotive extended temperature, 16-pin qfn package [x] ( 1 ) tape and reel option - [xxx] automotive note 1: tape and reel identifier only appears in the catalog part number description. this identifier is used for ordering purposes and is not printed on the device package. check with your microchip sales office for package availability with the tape and reel option. 2: for other small form-factor package avail- ability and marking information, please visit www.microchip.com/packaging or contact your local sales office. downloaded from: http:///
? 2015 microchip technology inc. ds00001957c-page 41 utc2000 note the following details of the code protection feature on microchip devices: microchip products meet the specification cont ained in their particular microchip data sheet. microchip believes that its family of products is one of the mo st secure families of its kind on the market today, when used i n the intended manner and under normal conditions. there are dishonest and possibly illegal meth ods used to breach the code protection fe ature. all of these methods, to our knowledge, require using the microchip products in a manner outside the operating specif ications contained in microchips data sheets. most likely, the person doing so is engaged in theft of intellectual property. microchip is willing to work with the customer who is concerned about the integrity of their code. neither microchip nor any other semiconduc tor manufacturer can guarantee the security of their code. code protection does not mean that we are guaranteeing the product as unbreakable. code protection is constantly evolving. we at microchip are committed to continuously improving the code protection features of our products. attempts to break microchips c ode protection feature may be a violation of the digital millennium copyright act. if such acts allow unauthorized access to your softwa re or other copyrighted work, you may have a right to sue for relief under that act. microchip received iso/ts-16949:2009 certification for its worldwide headquarters, design and wafer fabrication facilities in chandler and tempe, arizona; gresham, oregon and design centers in california and india. the companys quality system processes and procedures are for its pic ? mcus and dspic ? dscs, k ee l oq ? code hopping devices, serial eeproms, microperi pherals, nonvolatile memory and analog products. in addition, microchips quality system for the design and manufacture of development systems is iso 9001:2000 certified. quality management s ystem certified by dnv == iso/ts 16949 == information contained in this publication r egarding device applications and the like is provided only for your convenience and may be superseded by updates. it is your responsibility to ensure that your application meets with yo ur specifications. microchip make s no representations or warranties of any kind whether express or implied, written or oral, statutory or otherwise, related to the information, including but not limited to its condition , quality, performance, merchantability or fi tness for purpose . microchip disclaims all liabilit y arising from this information and its use. use of micro- chip devices in life support and/or safety applications is entirely at the buyer s risk, and the buyer agrees to defend, indemn ify and hold harmless microchip from any and all damages, claims, suits, or ex penses resulting from such use. no licenses are conveyed, impl icitly or otherwise, under any microchip intellectual property rights unless otherwise stated. trademarks the microchip name and logo, the microchip logo, dspic, flashf lex, flexpwr, jukeblox, k ee l oq , k ee l oq logo, kleer, lancheck, medialb, most, most logo, mplab, optolyzer, pic, picstart, pic 32 logo, righttouch, spynic, sst, sst logo, superflash and uni/o are registered trademarks of microchip technolog y incorporated in the u.s.a. and other countries. the embedded control solutions company and mtouch are registered tr ademarks of microchip technology incorporated in the u.s.a. analog-for-the-digital age, bodycom, chipkit, chipkit logo, codeguard, dspicdem, dspicdem.net, ecan, in-circuit serial programming, icsp, inter-chip connectivity, kleernet, kleernet logo, miwi, mpasm, mpf, mplab certified logo, mplib, mplink, multitrak, netdetach, omniscient code generation, picdem, picd em.net, pickit, pictail, righttouch logo, real ice, sqi, serial quad i/o, total endurance, tsharc, usbcheck, varisense, viewspan, wiperlock, wireless dna, and zena are trademarks of microchip technology incorporated in the u.s.a. and other countries. sqtp is a service mark of microchi p technology incorporated in the u.s.a. silicon storage technology is a regi stered trademark of microchip tech nology inc. in other countries. gestic is a registered trademarks of microc hip technology germany ii gmbh & co. kg, a subsidiary of microc hip technology inc., in other countries. all other trademarks mentioned herein are property of their respective companies. ? 2015, microchip technology incorporated, printed in the u.s.a., all rights reserved. isbn: 9781632776884 downloaded from: http:///
ds00001957c-page 42 ? 2015 microchip technology inc. americas corporate office 2355 west chandler blvd. chandler, az 85224-6199 tel: 480-792-7200 fax: 480-792-7277 technical support: http://www.microchip.com/ support web address: www.microchip.com atlanta duluth, ga tel: 678-957-9614 fax: 678-957-1455 austin, tx tel: 512-257-3370 boston westborough, ma tel: 774-760-0087 fax: 774-760-0088 chicago itasca, il tel: 630-285-0071 fax: 630-285-0075 cleveland independence, oh tel: 216-447-0464 fax: 216-447-0643 dallas addison, tx tel: 972-818-7423 fax: 972-818-2924 detroit novi, mi tel: 248-848-4000 houston, tx tel: 281-894-5983 indianapolis noblesville, in tel: 317-773-8323 fax: 317-773-5453 los angeles mission viejo, ca tel: 949-462-9523 fax: 949-462-9608 new york, ny tel: 631-435-6000 san jose, ca tel: 408-735-9110 canada - toronto tel: 905-673-0699 fax: 905-673-6509 asia/pacific asia pacific office suites 3707-14, 37th floor tower 6, the gateway harbour city, kowloon hong kong tel: 852-2943-5100 fax: 852-2401-3431 australia - sydney tel: 61-2-9868-6733 fax: 61-2-9868-6755 china - beijing tel: 86-10-8569-7000 fax: 86-10-8528-2104 china - chengdu tel: 86-28-8665-5511 fax: 86-28-8665-7889 china - chongqing tel: 86-23-8980-9588 fax: 86-23-8980-9500 china - dongguan tel: 86-769-8702-9880 china - hangzhou tel: 86-571-8792-8115 fax: 86-571-8792-8116 china - hong kong sar tel: 852-2943-5100 fax: 852-2401-3431 china - nanjing tel: 86-25-8473-2460 fax: 86-25-8473-2470 china - qingdao tel: 86-532-8502-7355 fax: 86-532-8502-7205 china - shanghai tel: 86-21-5407-5533 fax: 86-21-5407-5066 china - shenyang tel: 86-24-2334-2829 fax: 86-24-2334-2393 china - shenzhen tel: 86-755-8864-2200 fax: 86-755-8203-1760 china - wuhan tel: 86-27-5980-5300 fax: 86-27-5980-5118 china - xian tel: 86-29-8833-7252 fax: 86-29-8833-7256 asia/pacific china - xiamen tel: 86-592-2388138 fax: 86-592-2388130 china - zhuhai tel: 86-756-3210040 fax: 86-756-3210049 india - bangalore tel: 91-80-3090-4444 fax: 91-80-3090-4123 india - new delhi tel: 91-11-4160-8631 fax: 91-11-4160-8632 india - pune tel: 91-20-3019-1500 japan - osaka tel: 81-6-6152-7160 fax: 81-6-6152-9310 japan - tokyo tel: 81-3-6880- 3770 fax: 81-3-6880-3771 korea - daegu tel: 82-53-744-4301 fax: 82-53-744-4302 korea - seoul tel: 82-2-554-7200 fax: 82-2-558-5932 or 82-2-558-5934 malaysia - kuala lumpur tel: 60-3-6201-9857 fax: 60-3-6201-9859 malaysia - penang tel: 60-4-227-8870 fax: 60-4-227-4068 philippines - manila tel: 63-2-634-9065 fax: 63-2-634-9069 singapore tel: 65-6334-8870 fax: 65-6334-8850 taiwan - hsin chu tel: 886-3-5778-366 fax: 886-3-5770-955 taiwan - kaohsiung tel: 886-7-213-7828 taiwan - taipei tel: 886-2-2508-8600 fax: 886-2-2508-0102 thailand - bangkok tel: 66-2-694-1351 fax: 66-2-694-1350 europe austria - wels tel: 43-7242-2244-39 fax: 43-7242-2244-393 denmark - copenhagen tel: 45-4450-2828 fax: 45-4485-2829 france - paris tel: 33-1-69-53-63-20 fax: 33-1-69-30-90-79 germany - dusseldorf tel: 49-2129-3766400 germany - karlsruhe tel: 49-721-625370 germany - munich tel: 49-89-627-144-0 fax: 49-89-627-144-44 italy - milan tel: 39-0331-742611 fax: 39-0331-466781 italy - venice tel: 39-049-7625286 netherlands - drunen tel: 31-416-690399 fax: 31-416-690340 poland - warsaw tel: 48-22-3325737 spain - madrid tel: 34-91-708-08-90 fax: 34-91-708-08-91 sweden - stockholm tel: 46-8-5090-4654 uk - wokingham tel: 44-118-921-5800 fax: 44-118-921-5820 worldwide sales and service 07/14/15 downloaded from: http:///

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